Auto BGA rework station of SV550 with optics vision system

Specifications

BGA rework station of SV550
1) with LCD screen .
2) Optics vision system
3)Auto Bga rework sttion
4)Top station for repair

Descriptions

1  Hot air heater head and mounting head are designed 2  in 1, driven by  step electric motor, have both  the
auto soldering and mounting function; 
2  Three heaters( upper/lower hot air heater, bottom  IR heater) heating  independently,  time and  temperature
can be displayed digitally on touch screen; 
3  Upper heater is movable, with electromagnet positioning, convenient for manual placement operation; 
4  Large  movable  bottom  IR  heating  area(can  be  moved  100mm  to  left  or  to  right),  PCB  clamps  can  be
adjusted along with X & Y table flexibly, the max PCB size it can handle up to 550×500mm; 
5  Powerful cross flow fans cool the bottom heating area rapidly with stable speed. 
6  Color optical system with  functions of  split  vision,  zoom  in/out and micro-adjust, equipped with aberration
detection  device; with  auto  focus  and  software  operation  function,  27  X  optical  focus,can  realize  precise
alignment for bigger BGA, able to rework BGA sized up to 70×70mm; 
7  Embedded  industrial computer with a mouse control, PLC control,  real-time profile display, able  to display
theset profiles and practical profiles at  the  same  time;  can analyze  the practical profiles,  and  compare  them
with the history saved profiles; 
8  Color LCD monitor; 
9  Built-in vacuum pump; 60 °rotation in ? angle, mounting nozzle is micro-adjustable; 
10  8  segments  of  temperature  up(down)  and  8  segments  constant  temperature  control,  profile  saving  is
unlimited in the industrial computer; profile analysis can be carried out on touch scree; 
11  Suction  nozzle  can  identify material  and mounting  height  automatically,  and  can  control  the  air  pressure
within a small range; 
12  Equipped with different hot air nozzles, easy to replace and able to locate in any angle;

 

Specification
Upper heater: hot-air 800W                                      Lower heater: hot-air& infrared 1200W     
Bottom infrared heater: 3600W                                Power supply: single-phase 220V,50/60Hz,5.5KW
Workable PCB dimension: 20x20~550x500mm        Workable PCB thickness: 0.5mm ~ 2.5mm            
Workable BGA dimension: 1x1mm ~ 70x70mm       Min pitch of BGA ball: 0.15mm
Placement precision:  0.01mm                                 Max. BGA weight:  300g
Machine dimension: L850×W700×H63   0mm             Weight: Appox. 80Kgs